21-Aug-2026      11:21

Mold-Tek Packaging to consider bonus shares, dividend, and share capital increase

Mold-Tek Packaging Limited will hold a board meeting on Wednesday, August 26, 2026, to consider a proposal for the issuance of fully paid bonus equity shares to existing shareholders and to discuss an increase in the company’s authorized share capital, according to a regulatory filing with the BSE Limited and National Stock Exchange of India Limited. The board will also consider a final dividend for the financial year ended March 31, 2026, and fix details for the company’s 29th Annual General Meeting.

News source: Capital Market - Live News